InterPACK 2024 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

会议详情

01会议信息

InterPACK 2024 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

2024-10-08

2024-10-10

Silicon Valley San Jose, CA, USA

ASME

03评论

会议已结束

时间地点

时间:2024-10-08 至 2024-10-10
地点:Silicon Valley San Jose, CA, USA